2020-07-25 (土) 12:22:21 (64d)


Impact Factors of MEMS-related Journals

Impact Factors 2020

0JournalImpact FactorYearSource
1Advanced Energy Materials22.042020Link
2ACS Nano Letters11.2382019Link
3Wiley Small10.8562018Link
4Elsevier Biosensors and Bioelectronics10.257Link
5ACS Applied Materials & Interfaces8.7582019Link
6Elsevier Sensors & Actuators B7.1Link
7Sci. Techno. Adv. Mater. (STAM)5.7992019Link
8Microsystems & Nanoengineering5.6162018Link
9Elsevier Talanta5.3392019Link
10IEEE J. Solid-State Circuits4.929Link
11IEEE J. Selected Topics in Quantum Electronics (JSTQE)4.917Link
12IEEE Journal of Lightwave Technology (JLT)4.228Link
13IEEE Electron Device Letters (EDL)4.221Link
14Journal of The Electrochemical Society3.6622017Link
15AIP Applied Physics Letters (APL)3.5972019Link
16OSA Optics Express3.5612018Link
17JSAP Applied Physics Express (APEX)3.0892019Link
18IEEE Transactions on Electron Devices (Trans. ED)2.913Link
19Elsevier Sensors & Actuators A2.904Link
20IEEE J. Microelectromechanical Systems (JMEMS)2.532Link
21MDPI Micromachines2.523Link
22Journal of the Royal Society Open Science2.5042017Link
23Springer Journal of Materials Science: Materials in Medicine2.4892019Link
24IEEE Photonics Technology Letters (PTL)2.451Link
25Elsevier Microelectronic Engineering2.305Link
26AIP Journal of Applied Physics (JAP)2.2862019Link
27IEEE Transactions on Semiconductor Manufacturing1.977Link
28OSA Applied Optics1.9732018Link
29IEEE Transactions on Components, Packaging and Manufacturing Technology1.889Link
30IoP Journal of Micromechanics and Microengineering (JMM)1.7392019Link
31Springer Microsystem Technologies1.7372019Link
32AIP Advances1.627Link
33Elsevier Microelectronics Reliability1.535Link
34JSAP JJAP1.3762019Link
35IET Electronics Letters1.343Link
36IET Micro & Nano Letters0.975Link
37IEEJ Trans. EEE0.6682019Link
38Journal of Physics: Conference Series0.54Link
39Sensors and Materials0.5192016Link
40IEICE Electronics Express (ELEX)0.422019Link
41Wiley Electronics and Communications in Japan0.2292019Link
42Journal of Japan Institute of Electronics Packaging0.032019Link