DTIP 2019

2018-10-11 (木) 07:35:18 (1110d)
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Design, Integration, Test and Packaging of MEMS and MOEMS (DTIP 2019)

DTIP2019 – Paris, France – May 12th to May 15th, 2019

Paper submission deadline: December 2nd, 2018

Notification of acceptance: February 8th, 2019

Camera-ready due and Early bird registration: April 5th, 2019